Mechanical Wafer Pick with Spatula

The WHS-G2 Mechanical Wafer Pick with Spatula is a cleanroom-compatible edge grip handling tool designed for safe manual transfer of wafers from hotplates, platens, and vacuum chucks.

General

The WHS-G2 series is a precision manual wafer handling tool developed for applications requiring controlled wafer manipulation on flat process surfaces. Featuring a knife-edge spatula design, the system is ideal for lifting wafers from hotplates, platens, vacuum chucks, and other heated surfaces during semiconductor and cleanroom processing.

The normally-closed edge grip mechanism supports wafer thicknesses from 120 µm to 1000 µm, enabling safe and repeatable handling across a wide range of wafer types and substrate materials. The spatula edge is compatible with surfaces up to 160°C, making the WHS-G2 suitable for high-temperature wafer handling applications.

The bottom gripper is manufactured from ESD-safe antistatic PEEK for durability, chemical resistance, and contamination control, while the top gripper features a perfluorocarbon elastomer touchpad for gentle, scratch-free wafer contact.

The ergonomic handle and trigger mechanism improve operator comfort and control during manual wafer transfer, sorting, and wafer rescue operations. The WHS-G2 is suitable for silicon wafers, compound wafers, bonded wafers, Taiko wafers, MEMS devices, and optical components.

Standard configurations are available for 50 - 76 mm, 100 - 125 mm, 150 mm, and 200 mm wafers.

Features & Benefits

• Knife-edge spatula design: Enables precise wafer lifting from hotplates, platens, and vacuum chucks.
• High-temperature compatibility: Suitable for handling wafers on surfaces up to 160°C.
• ESD-safe construction: Antistatic PEEK body helps protect sensitive wafers and devices during handling.
• Scratch-free contact: Perfluorocarbon elastomer touchpad provides gentle wafer contact while minimizing contamination risk.
• Normally-closed edge grip: Supports secure handling of wafers from 120 µm to 1000 µm thickness.
• Ergonomic operation: Easy trigger mechanism improves operator control and reduces fatigue during repetitive handling tasks.
• Cleanroom compatible: ISO 4 (Class 10 FS209E) cleanliness rating for semiconductor and cleanroom applications.
• Wide substrate compatibility: Suitable for silicon wafers, compound wafers, bonded wafers, Taiko wafers, MEMS devices, and optical components.

Applications

The WHS-G2 Mechanical Wafer Pick is designed for cleanroom and semiconductor applications requiring safe and repeatable manual wafer handling from heated or flat process surfaces.

• Manual wafer transfer
• Wafer rescue operations
• Wafer sorting
• Hotplate wafer handling
• Vacuum chuck wafer handling
• MEMS and optical component handling
• Bonded and Taiko wafer handling
• Semiconductor and cleanroom processing

Content

1x WHS-G2 Mechanical Wafer Pick with Spatula

Specifications

* 50 - 76 mm,  150 mm, and 200 mm sizes available upon request.

Documentation

WHS-G2 Manual Mechanical Wafer Pick with Spatula Knife Edge - Datasheet